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P808/P908
- 1200*1000MM
- Counseling hotline：13686903576
Professional aluminum substrate
China's first aluminum substrate measurement company
-
-
Service Hotline：
13702275885
China's first aluminum substrate measurement company
13702275885
Product introduction and download
P808 Aluminum base copper clad laminate
Features：
Compliance with ROHS requirements，Not included SVHC of REACH regulation.
The thermal conductivity is higher than that of common FR-4 copper clad laminate, effectively increase the service life of electronic products.
Good machinability, Good dimensional stability
Electromagnetic shielding and good cost performance
Application:
LED lighting、LED Stage lighting
AluSum material：1060#
Thickness：0.6~2.0mm
Copper foil ：0.5OZ、1OZ、2OZ
Size：1000mm*1200mm
Functions：
|
Experimental method |
Unit |
Typical Value |
|
|
Dielectric layer thickness |
IPC-TM-650 2.2.18.1 |
um |
80~85 |
|
Thermal Stress |
IPC-TM-650-2.4.13.1 |
S |
288℃＞120s |
|
Peel Strength |
IPC-TM-650-2.4.8.1 |
N/mm |
＞1.0 |
|
Leakage voltage |
50*50mm(Copper foil)，electric current＜0.5mA |
KV(DC) |
＞4 |
|
electric current＜5mA |
KV(AC) |
≥3 |
|
|
Dielectric Break-down |
IPC-TM-650-2.5.6 |
KV(AC) |
≥5 |
|
TG（DSC） |
IPC-TM-650-2.4.25 |
℃ |
>135 |
|
Thermal expansion coefficient（TMA） |
IPC-TM-650-2.4.24 |
％(50~260℃) |
3.2 |
|
Surface Resistance |
IPC-TM-650-2.5.17.1 |
Ω |
>104 |
|
Volume Resistance |
IPC-TM-650-2.5.17.1 |
Ω.cm |
>106 |
|
Thermal conductivity |
ASTM D 5470 |
W/m.k |
＞0.7 |
|
R Thermal Resistance |
/ |
℃/W |
＜0.8 |
|
Combustibility |
Not applicable |
||
