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P805/P905
- 1200*1000MM
- Counseling hotline：13686903576
Professional aluminum substrate
China's first aluminum substrate measurement company
-
-
Service Hotline：
13702275885
China's first aluminum substrate measurement company
13702275885
Product introduction and download
P805/P905 Aluminum base copper clad laminate
Features：
Compliance with ROHS requirements，Not included SVHC of REACH regulation.
The thermal conductivity is higher than that of common FR-4 copper clad laminate, effectively increase the service life of electronic products.
Good machinability, Good dimensional stability
Electromagnetic shielding and good cost performance
Application:
LED lighting、LED Stage lighting
AluSum material：1060#
Thickness：0.6~2.0mm
Copper foil ：0.5OZ、1OZ、2OZ
Size：1000mm*1200mm
Functions：
|
Experimental method |
Unit |
Typical Value |
|
|
Dielectric layer thickness |
IPC-TM-650 2.2.18.1 |
um |
80~85 |
|
Thermal Stress |
IPC-TM-650-2.4.13.1 |
S |
288℃＞120s |
|
Peel Strength |
IPC-TM-650-2.4.8.1 |
N/mm |
＞1.0 |
|
Leakage voltage |
50*50mm(Copper foil)，electric current＜0.5mA |
KV(DC) |
＞4 |
|
electric current＜5mA |
KV(AC) |
≥2 |
|
|
Dielectric Break-down |
IPC-TM-650-2.5.6 |
KV(AC) |
≥5 |
|
TG（DSC） |
IPC-TM-650-2.4.25 |
℃ |
>135 |
|
Thermal expansion coefficient（TMA） |
IPC-TM-650-2.4.24 |
％(50~260℃) |
3.2 |
|
Surface Resistance |
IPC-TM-650-2.5.17.1 |
Ω |
>104 |
|
Volume Resistance |
IPC-TM-650-2.5.17.1 |
Ω.cm |
>106 |
|
Thermal conductivity |
ASTM D 5470 |
W/m.k |
＞0.4 |
|
R Thermal Resistance |
/ |
℃/W |
＜0.8 |
|
Not applicable |
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